PCB handling and transport
PCB Size (L × W) min. 50 × 50 mm / max. 410 × 360 mm
PCB Weight max. 4.0 kg
Solder Pad Dimensions min. 01005 (inch) / max. 15 × 15 mm
PCB Feed Height 900 -20 / +70 mm
Measurable Solder Depot Properties
No / too little solder paste, print misalignment, depot volume, depot height, foreign objects etc.
Measurement System
Camera System 400 MPix CMOS
Measuring Principle i3D Photometric Stereo Technique
Measurement Resolution 15 µm / pixel (standard) / 10 µm / pixel (high resolution)
Field of View (FOV) 30 × 30 mm / 20 × 20 mm
Image Processing Speed 0.2 s / FOV
Machine Properties and Dimensions
Dimensions (L × W × H) 940 × 1276 × 1530 mm
Weight 1,000 kg
PC and Software
Operating System Windows 7, 64 bit
Interfaces SMEMA, OK / NG, USB, Ethernet
Operating Requirements
Power Supply 380 V, three phases
Compressed Air 5 bar
Ambient Conditions 15 – 30° C, 30 – 65 % RH
Standards (selection)
AWC, code recognition on PCB, true zero measurement reference, automatic calibration
Available Options and Accessories (selection)
Closed-Loop with screen paste printer, grid tools for supporting the PCB, TOPSS connection for remote analysis, long board option
Please refer to product specifications for details.
Specifications and design subject to change without notice.
